Solder preforms can provide precise solder amount for connected devices, which are considered to be an ideal solution for applications of PCB assebly, chip connection, auto parts, power modules panel connection, filered connectors and electronic conponent assembly,...

The company can manufacture various shapes of preforms in different alloys with thickness ranges from 0,05 mm, and also can provide differen types of solder preforms.

Classification

• By shape: rectangle, circle, ring, frame
• With thickness: die - cut ring, thin - walled ring, particles, corrugated sheet and other complex shapes
• By purpose: Solder preforms for coating, cleaning, SMT filler and low temperature